PTM En

The FeHonda PTM (Phase Change Material) series is designed to provide maximum heat transfer in the cooling systems of high-performance computers and mobile devices. Presented as a solid, easily applicable layer at room temperature, the pad softens and undergoes a phase change when the component temperature reaches 45°C, filling all micro-level surface irregularities like thermal paste. This special structure completely prevents "pump-out" (paste leaking out due to heating-cooling cycles) and drying problems that occur over time with traditional thermal pastes. While offering ultra-high heat transfer performance close to liquid metal, its non-conductive nature eliminates the risk of short circuits or component damage. It is a long-lasting and stable cooling solution for gaming laptops, graphics card cores (GPUs), and game consoles that experience overheating issues.